On November 13, Infineon announced that it has acquired a startup called Siltectra, which has also included an innovative technology (Cool Split). “Cool Split” is an efficient process for crystal material that minimizes material loss.
Infineon will use this technology for the cutting of silicon carbide (SiC) wafers, doubling the number of chips that can be produced on a single wafer. It is reported that the acquisition has obtained the consent of the major shareholder MIG Fonds venture capital, the offer is 124 million euros (about 139 million US dollars / 9.7 billion yuan).
Founded in 2010, Siltectra is a Dresden-based startup with more than 50 patented intellectual property portfolios.
Dr. Reinhard Ploss, CEO of Infineon, said: “This acquisition will help us to utilize new SiC materials and expand our excellent product portfolio. Our systematic understanding and unique expertise in thin wafer technology will be with Siltectra Innovation and cold cutting technology complement each other."
Compared to conventional saw cutting technology, Siltectra has developed a new technology for decomposing crystalline materials that can reduce material losses to technology. The technology is equally applicable to carbon SiC and will be industrially produced at its existing Dresden plant and at the Infineon (Austria) Villach plant.
As the only company to produce 300mm silicon thin wafers, Infineon is well positioned to apply thin wafer technology to SiC products. It is expected that Infineon will be able to move to mass production in the next five years.
Over time, cold cutting technology is expected to be more widely used, such as ingot segmentation, or for materials other than SiC.
Ploss also hopes that the technology will help improve its economy and resource use, especially the current growing electric vehicle business. Today, SiC products are used in very efficient and compact solar inverters. In the future, SiC will play an increasingly important role in electric vehicles.
Recently, Infineon announced its results for the fourth quarter of FY 2018 (as of September 30, 2018). The highlights are as follows:
• Fourth Quarter of FY18: Revenue of €2,047 million, a 5% increase from the previous quarter; operating profit of €400 million; and a profit margin of 19.5%.
• FY 2018: Revenue of 7.599 billion euros, an increase of more than 8% year-on-year; operating profit of 1.353 billion euros, a profit margin of 17.8%.
• Outlook for FY 2019: Assume that the exchange rate of the euro against the US dollar is 1.15, and the year-on-year revenue growth will reach 11% (plus or minus two percentage points), and the profit margin will reach 18%.
• Outlook for the first quarter of fiscal year 2019: Assume that the exchange rate of the euro against the US dollar is 1.15. Due to seasonal reasons, the revenue will decrease by 4% (plus or minus two percentage points) and the profit margin will be 17.5%.
• Plans to raise the dividend per share to €0.27.
Dr. Reinhard Ploss, CEO of Infineon Technologies AG, said, “The strong performance in the fourth quarter was a good end to the excellent 2018 fiscal year. In the quarter, our current business single-season revenue exceeded 2 billion for the first time. The euro, the digitization and electrification of life, has led to a continued rise in demand for Infineon products and solutions. At the beginning of FY19, we have received a large number of orders. Our goal is to continue to grow faster than the market average. We will Actively pay attention to the development of politics and economy, and respond promptly and correctly to market demand."
